达方电子 -j9九游会九游国际版

		july. 6. 2020 \| \| j9九游会九游国际版-j9九游会直营
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　j9九游会九游国际版首页> 产品介绍> 整合元件暨材料

积层陶瓷电容

积层陶瓷电感 (mlci)

mlci 测试规格
electrical characteristics

no.	item	test condition	requirements
1	inductance	a. temperature: 25 /- 3℃ b. relative humidity: 45 to 75%rh c. measuring equipment and fixture: 1608(0603) hp 4291 16192a 1005(0402) hp 4287 16193a 0603(0201) hp 4287 16196c	within specified tolerance.
2	q value	a. temperature: 25 /- 3℃ b. relative humidity: 45 to 75%rh c. measuring equipment and fixture: 1608(0603) hp 4291 16192a 1005(0402) hp 4287 16193a 0603(0201) hp 4287 16196c	in accordance with electrical specification.
3	dc resistance	a. temperature: 25 /- 3℃ b. relative humidity: 45 to 75%rh c. measuring equipment: hp 4338	in accordance with electrical specification.

mechanical characteristics

no.	item	test condition	requirements
4	appearance	inductors shall be visually inspected for visible evidence of defect.	in accordance with specification.
5	dimension	dimension shall be measured with caliper or micrometer	in accordance with dimension specification.
6	solder-ability	immerse a test sample into a methanol solution containing rosin and immerse into molten solder of 230 /-5°c for 5 /-1 seconds.	more than 75% of the terminal electrode part shall be covered with fresh solder.
7	bending strength	solder the chip to test jig then apply a force in the direction shown in below. the soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.	1. no mechanical damage shall be observed. 2. rdc-value: to meet the initial spec.
8	resistance to soldering heat	immerse a test sample into a methanol solution containing resin, preheat it at 120 to 150°c for 1 minutes and immerse into molten solder of 270 /-5°c for 10 /-1 seconds so that both terminal electrodes are completely submerged.	no visible damage inductance variation within 10% q variation within 20%

reliability

no.	item	test condition	requirements
9	thermal shock	solder a test sample to printed circuit board, and conduct 5 cycles of test under the conditions shown as below. 0603 & 1005 operating temp. range: -55~125°c 1608 operating temp. range: -40~85°c cycle: maximum operating temp. /(30 /-3min) minimum operating temp. /(30 /-3min)	no visible damage. inductance variation within 10%. q variation within 20%.
10	high humidity state life test	keep a test sample in an atmosphere with a temperature of 40 /-2°c, 90~95%rh for 500 /-12 hours. after the removal from test chamber, 2 to 3 hour of recovery under standard condition, and measurement shall be made after 24 /-2 hrs of recover under standard condition.	no visible damage. inductance variation within 10%. q variation within 20%.
11	high humidity load life test	solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of 40 /-2°c, 90~95%rh for 500 /-12 hours while supplying the rated current. after the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24 /-2 hrs of recovery under standard condition.	no visible damage. inductance variation within 10%. q variation within 20%.
12	high temperature state life test	keep a test sample in an atmosphere with a temperature of 85 /-2°c for 500 /-12 hours. after the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24 /-2 hrs of recovery under standard condition.	no visible damage. inductance variation within 10%. q variation within 20%.
13	high temperature load	solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of 85 /-2°c for 500 /-12 hours while supplying the rated current. after the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24 /-2 hrs of recovery under standard condition.	no visible damage. inductance variation within 10%. q variation within 20%.

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